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Background on 2023 Eri Summit Darpa Strategy
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Background on 2023 Eri Summit Darpa Strategy

Dr. Stefanie Tompkins, Director, Defense Advanced Research Projects Agency ( Dr. Bill Carter, Boeing Vice President of Materials and Manufacturing Technology, presents "Boeing & Microelectronics." Dr. Josh Fryman, Fellow of Intel Corporation, presents "New Applications Enabled by Complex 3D Microsystems." Mr. Mark Papermaster, Chief Technology Officer and Executive Vice President of AMD, presents "Innovation to meet AI and HPC ... Dr. PR “Chidi” Chidambaram, Qualcomm Vice President of Engineering and Fellow, presents "Semiconductor Technology and ... Dr. Andrew Schwartz, Office of Science Director of Material Sciences and Engineering Division of the Department of Energy, ...

... honored to have Senator Maria Cantwell here in Seattle today to help kick off the Dr. Todd Younkin, President and Chief Executive Officer of Semiconductor Research Corporation, presents "JUMP 2.0 Overview". ... forward conferences Series last year we are pleased to welcome congressman adaman Adam Smith to the Dr. Muhannad Bakir, Georgia Institute of Technology Professor of Electrical and Computer Engineering, presents "Challenges and ... Dr. Priya Panda, Yale University Assistant Professor of Electrical Engineering, presents "How to Efficiently Learn On-Device?".